- All sections
- H - Electricity
- H10B - Electronic memory devices
- H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
Patent holdings for IPC class H10B 80/00
Total number of patents in this class: 344
10-year publication summary
0
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0
|
0
|
0
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0
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0
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2
|
2
|
126
|
213
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Samsung Electronics Co., Ltd. | 131630 |
153 |
Kioxia Corporation | 9847 |
33 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
26 |
Changxin Memory Technologies, Inc. | 4732 |
13 |
Monolithic 3D Inc. | 270 |
11 |
Micron Technology, Inc. | 24960 |
9 |
SK Hynix Inc. | 11030 |
8 |
Mediatek Inc. | 4584 |
8 |
Yangtze Memory Technologies Co., Ltd. | 1940 |
8 |
SJ Semiconductor (Jiangyin) Corporation | 125 |
5 |
iCometrue Company Limited | 64 |
4 |
Intel Corporation | 45621 |
3 |
Semiconductor Energy Laboratory Co., Ltd. | 10902 |
3 |
nD-HI Technologies Lab, Inc. | 17 |
3 |
Adeia Semiconductor Bonding Technologies Inc. | 185 |
3 |
International Business Machines Corporation | 60644 |
2 |
Alibaba Group Holding Limited | 7149 |
2 |
Applied Materials, Inc. | 16587 |
2 |
LG Innotek Co., Ltd. | 6758 |
2 |
JPMorgan Chase Bank, National Association | 10964 |
2 |
Other owners | 44 |